The main difference between oxygen and non-oxygen silicon metal is the oxygen content in its manufacturing process and the resulting differences in physical and chemical properties.
Manufacturing process and physical properties
Manufacturing process: Oxygen-permeable silicon: Oxygen is intentionally introduced during the manufacturing process, usually through a high-temperature oxidation process to form a microstructure of silicon dioxide (SiO₂). Non-oxygen-permeable silicon: The introduction of oxygen is avoided as much as possible during the manufacturing process to maintain the purity of the silicon material.
Physical properties: Oxygen-permeable silicon: Due to the presence of silicon dioxide, its hardness and wear resistance are higher, suitable for applications requiring high wear resistance. Non-oxygen-permeable silicon: It has better electrical and thermal conductivity and is suitable for the electronics and semiconductor industries.
Application areas:Oxygen-permeable silicon: High wear resistance applications: Such as manufacturing wear-resistant parts and tools, brake pads and bearings, etc..
Processing difficulty: Due to its high hardness, it is difficult to process, requiring the use of harder tools and higher processing temperatures.
Non-conductive silicon:Electronics and semiconductor industries: Widely used in the manufacture of high-performance electronic components and heat sinks due to its excellent electrical and thermal conductivity.
Processing difficulty: Relatively easy to process, but more care needs to be taken during processing to avoid introducing impurities.
In summary, there are significant differences between oxygen-permeable silicon and non-oxygen-permeable silicon in manufacturing process, physical properties and application fields, which determine their applicability and market price trends in different industrial fields.
Post time: Nov-04-2024
